Ultraflat Cu(111) foils by surface acoustic wave-assisted annealing

• Main Authors: Tian, Bo, Li, Junzhu, Wang, Qingxiao, Samad, Abdus, Yuan, Yue, Hedhili, Mohamed Nejib, Jangir, Arun, Gruenewald, Marco, Lanza, Mario, Schwingenschlögl, Udo, Fritz, Torsten, Zhang, Xixiang, Liu, Zheng
• Other Authors: School of Materials Science and Engineering
• Format: Article
• Language: English
• Published: 2025
• Subjects: Engineering; Acoustic wave; Annealing
• Online Access: https://hdl.handle.net/10356/182075
• Institution: Nanyang Technological University

Ultraflat metal foils are essential for semiconductor nanoelectronics applications and nanomaterial epitaxial growth. Numerous efforts have been devoted to metal surface engineering studies in the past decades. However, various challenges persist, including size limitations, polishing non-uniformiti...