Promoting sustainable practices in the semiconductor industry through cull and runner recycling

While a cornerstone of modern technology, the semiconductor industry generates substantial waste during the package production. This could pose environmental and waste management challenges. As the world shifts toward a more sustainable future, recycling has become increasingly important. This...

全面介紹

Saved in:
書目詳細資料
主要作者: Liu, Yuqi
其他作者: Wang Hong
格式: Thesis-Master by Coursework
語言:English
出版: Nanyang Technological University 2025
主題:
在線閱讀:https://hdl.handle.net/10356/182546
標簽: 添加標簽
沒有標簽, 成為第一個標記此記錄!
實物特徵
總結:While a cornerstone of modern technology, the semiconductor industry generates substantial waste during the package production. This could pose environmental and waste management challenges. As the world shifts toward a more sustainable future, recycling has become increasingly important. This study focuses on the recycle of unwanted culls and runners, which essentially are semi-cured epoxy molding compounds (EMC), generated during the molding process. The literature review provides deeper understanding on the recycling methods and challenges faced by the semiconductor industry. We also explore the mechanical griding of culls and runners, followed by material characterization using the scanning electron microscopy (SEM), thermogravimetric analysis (TGA), and differential scanning calorimetry (DSC) techniques, etc.. An established method and proper material characterization will pave the way for the upcycling of waste into high value applications.