Promoting sustainable practices in the semiconductor industry through cull and runner recycling

While a cornerstone of modern technology, the semiconductor industry generates substantial waste during the package production. This could pose environmental and waste management challenges. As the world shifts toward a more sustainable future, recycling has become increasingly important. This...

Full description

Saved in:
Bibliographic Details
Main Author: Liu, Yuqi
Other Authors: Wang Hong
Format: Thesis-Master by Coursework
Language:English
Published: Nanyang Technological University 2025
Subjects:
Online Access:https://hdl.handle.net/10356/182546
Tags: Add Tag
No Tags, Be the first to tag this record!
Institution: Nanyang Technological University
Language: English
Description
Summary:While a cornerstone of modern technology, the semiconductor industry generates substantial waste during the package production. This could pose environmental and waste management challenges. As the world shifts toward a more sustainable future, recycling has become increasingly important. This study focuses on the recycle of unwanted culls and runners, which essentially are semi-cured epoxy molding compounds (EMC), generated during the molding process. The literature review provides deeper understanding on the recycling methods and challenges faced by the semiconductor industry. We also explore the mechanical griding of culls and runners, followed by material characterization using the scanning electron microscopy (SEM), thermogravimetric analysis (TGA), and differential scanning calorimetry (DSC) techniques, etc.. An established method and proper material characterization will pave the way for the upcycling of waste into high value applications.