The analysis of leadframe packages reliability for automotive applications under thermal cycling
Lead frame packaging technology is extensively employed in automotive and industrial applications due to its cost-effectiveness, strong thermal performance, and mechanical stability. Among such packages, Quad Flat Non-Lead (QFN) packages present critical challenges in board-level solder joint...
Saved in:
| Main Author: | |
|---|---|
| Other Authors: | |
| Format: | Thesis-Master by Coursework |
| Language: | English |
| Published: |
Nanyang Technological University
2025
|
| Subjects: | |
| Online Access: | https://hdl.handle.net/10356/182890 |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
| Institution: | Nanyang Technological University |
| Language: | English |