Oxygen-based microwave induced plasma etching for epoxy molding compound removal in advanced semiconductor devices

• Main Authors: Tan, Hong Siang, Zee, Bernice, Gan, Chee Lip, Kor, Katherine, Tang, Jiaqi, McKinnon, Mark
• Other Authors: School of Materials Science and Engineering
• Format: Conference or Workshop Item
• Language: English
• Published: 2025
• Subjects: Engineering; Microwave induced plasma; Epoxy molding compounds
• Online Access: https://hdl.handle.net/10356/182908
• Institution: Nanyang Technological University

Heterogenous integration has led to the development of advanced semiconductor packages with better performance and smaller form factor. Such packages usually comprise of multiple dies and embedded components which are encapsulated with epoxy molding compounds (EMCs) to improve the reliability perfor...