Oxygen-based microwave induced plasma etching for epoxy molding compound removal in advanced semiconductor devices

• المؤلفون الرئيسيون: Tan, Hong Siang, Zee, Bernice, Gan, Chee Lip, Kor, Katherine, Tang, Jiaqi, McKinnon, Mark
• مؤلفون آخرون: School of Materials Science and Engineering
• التنسيق: Conference or Workshop Item
• اللغة: English
• منشور في: 2025
• الموضوعات: Engineering; Microwave induced plasma; Epoxy molding compounds
• الوصول للمادة أونلاين: https://hdl.handle.net/10356/182908

Heterogenous integration has led to the development of advanced semiconductor packages with better performance and smaller form factor. Such packages usually comprise of multiple dies and embedded components which are encapsulated with epoxy molding compounds (EMCs) to improve the reliability perfor...