Oxygen-based microwave induced plasma etching for epoxy molding compound removal in advanced semiconductor devices

• Main Authors: Tan, Hong Siang, Zee, Bernice, Gan, Chee Lip, Kor, Katherine, Tang, Jiaqi, McKinnon, Mark
• 其他作者: School of Materials Science and Engineering
• 格式: Conference or Workshop Item
• 語言: English
• 出版: 2025
• 主題: Engineering; Microwave induced plasma; Epoxy molding compounds
• 在線閱讀: https://hdl.handle.net/10356/182908
• 機構: Nanyang Technological University

Heterogenous integration has led to the development of advanced semiconductor packages with better performance and smaller form factor. Such packages usually comprise of multiple dies and embedded components which are encapsulated with epoxy molding compounds (EMCs) to improve the reliability perfor...