Investigation of flexible bellow for cooling isolated electronic components
The present work investigates the method of indirect liquid cooling employing a flexible bellow liquid heat sink sandwiched between two hot plates in electronic package. The scope of the project includes the formulation and development of a vertically averaged 2-D numerical model to simulate the hea...
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| Main Author: | |
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| Other Authors: | |
| Format: | Theses and Dissertations |
| Language: | English |
| Published: |
2009
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| Subjects: | |
| Online Access: | http://hdl.handle.net/10356/19871 |
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| Institution: | Nanyang Technological University |
| Language: | English |
| Summary: | The present work investigates the method of indirect liquid cooling employing a flexible bellow liquid heat sink sandwiched between two hot plates in electronic package. The scope of the project includes the formulation and development of a vertically averaged 2-D numerical model to simulate the heat and fluid flow phenomena in the bellow. The numerical model applies the finite volume method on a staggered grid. Solutions are obtained using the TDMA (TriDiagonal-Matrix Algorithm) and pressure-velocity correction technique. The numerical model is assessed by experimental work in a previous study and is found to be in fair agreement. |
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