Direct liquid cooling of simulated electronic chips in a rectangular channel

• Main Author: Xu, Guo Ping.
• Other Authors: Tso, Chin Ping
• Format: Theses and Dissertations
• Language: English
• Published: 2009
• Subjects: DRNTU::Engineering::Mechanical engineering
• Online Access: http://hdl.handle.net/10356/19998
• Institution: Nanyang Technological University

Experiments are performed to study the single-phase forced convection heat transfer and subcooled flow boiling heat transfer from an in-line four simulated chips in a rectangular channel using water and FC-72. The experimental data of single-phase heat transfer cover the laminar flow and turbulent flow with Reynolds number based on chip length (Z,=10 mm)ranging from 6xl02 to 8xl04 for an inlet temperature of T^25°C. The effects of geometrical parameters such as chip number, channel height (H=0.5, 0.7, 1.0)and protruding height (B=0, 0.1, 0.2), and working fluid (water, Pr=6.0, FC-72, Pr=11.5)are studied. Transitional Reynolds number and flow regimes are deduced from the heat transfer data. The experimental results from single-phase heat transfer indicate that the heat transfer coefficient is strongly affected by Reynolds number and protruding height, and weakly by channel height. Fully-developed values of heat transfer coefficient are reached after the third chip. Results from the present study of water cooling agree well with results from the literature for air-cooling of electronic components at the similar conditions, when Prandtl number scaling is considered. The experimental results from FC-72 are similar to those from water for flush-mounted chips, but are on the high end when protruding chips are used.