Computer aided IC packaging design

In recent years knowledge based applications have gained access in many areas of engineering. This kind of approach is particularly appropriate, among others, in solving problems related to selection, classification, configuration, diagnosis, monitoring and planning.

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Bibliographic Details
Main Author:	Zahiruddin A. K. M.
Other Authors:	Song, Bin
Format:	Theses and Dissertations
Language:	English
Published:	2009
Subjects:	DRNTU::Engineering::Manufacturing::CAD/CAM systems
Online Access:	http://hdl.handle.net/10356/20525
Tags:	Add Tag No Tags, Be the first to tag this record!
Institution:	Nanyang Technological University
Language:	English

id	sg-ntu-dr.10356-20525
record_format	dspace
spelling	sg-ntu-dr.10356-205252020-09-26T22:13:33Z Computer aided IC packaging design Zahiruddin A. K. M. Song, Bin Gintic Institute of Manufacturing Technology DRNTU::Engineering::Manufacturing::CAD/CAM systems In recent years knowledge based applications have gained access in many areas of engineering. This kind of approach is particularly appropriate, among others, in solving problems related to selection, classification, configuration, diagnosis, monitoring and planning. Master of Science (Computer Integrated Manufacturing) 2009-12-15T03:16:49Z 2009-12-15T03:16:49Z 1998 1998 Thesis http://hdl.handle.net/10356/20525 en NANYANG TECHNOLOGICAL UNIVERSITY 104 p. application/pdf
institution	Nanyang Technological University
building	NTU Library
country	Singapore
collection	DR-NTU
language	English
topic	DRNTU::Engineering::Manufacturing::CAD/CAM systems
spellingShingle	DRNTU::Engineering::Manufacturing::CAD/CAM systems Zahiruddin A. K. M. Computer aided IC packaging design
description	In recent years knowledge based applications have gained access in many areas of engineering. This kind of approach is particularly appropriate, among others, in solving problems related to selection, classification, configuration, diagnosis, monitoring and planning.
author2	Song, Bin
author_facet	Song, Bin Zahiruddin A. K. M.
format	Theses and Dissertations
author	Zahiruddin A. K. M.
author_sort	Zahiruddin A. K. M.
title	Computer aided IC packaging design
title_short	Computer aided IC packaging design
title_full	Computer aided IC packaging design
title_fullStr	Computer aided IC packaging design
title_full_unstemmed	Computer aided IC packaging design
title_sort	computer aided ic packaging design
publishDate	2009
url	http://hdl.handle.net/10356/20525
_version_	1681058600256012288

Computer aided IC packaging design

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