Computer aided IC packaging design
In recent years knowledge based applications have gained access in many areas of engineering. This kind of approach is particularly appropriate, among others, in solving problems related to selection, classification, configuration, diagnosis, monitoring and planning.
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| Format: | Theses and Dissertations |
| Language: | English |
| Published: |
2009
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| Online Access: | http://hdl.handle.net/10356/20525 |
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| Institution: | Nanyang Technological University |
| Language: | English |
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