Soldering alloys : composition, microstructure and joint characteristics

• Main Author: Ang, Edwin Hui Jun
• Other Authors: Chen Zhong
• Format: Final Year Project
• Language: English
• Published: 2010
• Subjects: DRNTU::Engineering::Materials::Metallic materials::Alloys
• Online Access: http://hdl.handle.net/10356/35666
• Institution: Nanyang Technological University

Microstructure and mechanical properties of two new solder materials were investigated. Its elemental composition before and after cooling was also studied. New solder material was proposed to be able to join ceramics such as aluminium or titanium oxide without much intensive sample preparation. T...