New techniques for localization of shorted and open interconnect failures in ICs by using laser beam technology

• Main Author: Thaw Zin Myint.
• Other Authors: Ong, Vincent Keng Sian
• Format: Theses and Dissertations
• Published: 2008
• Subjects: DRNTU::Engineering::Electrical and electronic engineering::Integrated circuits
• Online Access: http://hdl.handle.net/10356/3576
• Institution: Nanyang Technological University

Open-circuit and short-circuit defects in electrical conductors within integrated circuits (ICs) can result in major IC yield and reliability problems. A capability for localizing and identifying these types of defects is important for analyzing ICs to determine failure mechanisms therein, for quali...