Investigation of failure mechanism in packaging of inkjet printer head

111 p.

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Bibliographic Details
Main Author:	Tey, Ju Nie.
Other Authors:	Subodh Gautam Mhaisalkar
Format:	Theses and Dissertations
Published:	2010
Subjects:	DRNTU::Engineering::Materials::Electronic packaging materials
Online Access:	http://hdl.handle.net/10356/35967
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Institution:	Nanyang Technological University

id	sg-ntu-dr.10356-35967
record_format	dspace
spelling	sg-ntu-dr.10356-359672023-03-04T16:31:54Z Investigation of failure mechanism in packaging of inkjet printer head Tey, Ju Nie. Subodh Gautam Mhaisalkar School of Materials Science & Engineering DRNTU::Engineering::Materials::Electronic packaging materials 111 p. Encapsulation failures in inkjet print head assembly were studied with four approaches. The impact of ultraviolet (UV) cure and post cure conditions on the mechanical properties of Polyurethane Acrylate (PUA) encapsulant was first studied. The investigation was continued by probing the interaction between PUA, processed using different UV curing conditions, with moisture and ink. The manner by which PUA properties degraded upon soaking in solvent was investigated. Electrified ink immersion (EII) testing was conducted to determine the barrier layer properties of the PUA. Finally, with the finite element (FE) modeling, moisture distribution and swelling induced stress in the print head package was determined by inputting all relevant parameters obtained from various experiments. Design parameters were varied to understand the effect modulus and encapsulant thickness to the swelling stress and hence to package reliability. Master of Engineering (MSE) 2010-04-23T02:15:29Z 2010-04-23T02:15:29Z 2006 2006 Thesis http://hdl.handle.net/10356/35967 application/pdf
institution	Nanyang Technological University
building	NTU Library
continent	Asia
country	Singapore Singapore
content_provider	NTU Library
collection	DR-NTU
topic	DRNTU::Engineering::Materials::Electronic packaging materials
spellingShingle	DRNTU::Engineering::Materials::Electronic packaging materials Tey, Ju Nie. Investigation of failure mechanism in packaging of inkjet printer head
description	111 p.
author2	Subodh Gautam Mhaisalkar
author_facet	Subodh Gautam Mhaisalkar Tey, Ju Nie.
format	Theses and Dissertations
author	Tey, Ju Nie.
author_sort	Tey, Ju Nie.
title	Investigation of failure mechanism in packaging of inkjet printer head
title_short	Investigation of failure mechanism in packaging of inkjet printer head
title_full	Investigation of failure mechanism in packaging of inkjet printer head
title_fullStr	Investigation of failure mechanism in packaging of inkjet printer head
title_full_unstemmed	Investigation of failure mechanism in packaging of inkjet printer head
title_sort	investigation of failure mechanism in packaging of inkjet printer head
publishDate	2010
url	http://hdl.handle.net/10356/35967
_version_	1759856935425802240

Investigation of failure mechanism in packaging of inkjet printer head

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