Study of power supply design for high speed circuit

Power noise is one of the key signal integrity problems. Unlike the design of signal paths, where the design rules in one product can often be applied to other products of similar bandwidth, the goal and constraints of designing power distribution network (PDN) can vary widely from product to produc...

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Main Author: Toh, Tze Yan.
Other Authors: See Kye Yak
Format: Final Year Project
Language:English
Published: 2010
Subjects:
Online Access:http://hdl.handle.net/10356/40277
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Institution: Nanyang Technological University
Language: English
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spelling sg-ntu-dr.10356-402772023-07-07T16:52:21Z Study of power supply design for high speed circuit Toh, Tze Yan. See Kye Yak School of Electrical and Electronic Engineering DRNTU::Engineering::Electrical and electronic engineering::Power electronics Power noise is one of the key signal integrity problems. Unlike the design of signal paths, where the design rules in one product can often be applied to other products of similar bandwidth, the goal and constraints of designing power distribution network (PDN) can vary widely from product to product so design features of one product should not be applied to another product blindly. The primary purpose of PDN is to keep voltage constant across the pads of integrating circuits (ICs). The design of PDN also minimizes ground bounce and EMI problems. The main focus in this report is to understand the concept behind the design of a power distribution network and how each component play a role in ensuring power integrity (PI). An in-depth literature review on the various key components affecting PDN is first carried out. Next the identification of the design goal so that appropriate techniques can be applied to meet this criterion. Two major techniques are studied, including the using of decoupling where global utilizing large capacitance (4.7 µF) satisfy frequency below 30 MHz while local decoupling utilizing smaller capacitance (0.01 – 1 µF) are able to achieve up to 700 MHz. For higher frequency consideration, reducing the plane separation from 63 mils to 40 mils in PCB layer stack-up provides additional 5 – 10 dB impedance reduction. Bachelor of Engineering 2010-06-14T04:58:27Z 2010-06-14T04:58:27Z 2010 2010 Final Year Project (FYP) http://hdl.handle.net/10356/40277 en Nanyang Technological University 57 p. application/pdf
institution Nanyang Technological University
building NTU Library
continent Asia
country Singapore
Singapore
content_provider NTU Library
collection DR-NTU
language English
topic DRNTU::Engineering::Electrical and electronic engineering::Power electronics
spellingShingle DRNTU::Engineering::Electrical and electronic engineering::Power electronics
Toh, Tze Yan.
Study of power supply design for high speed circuit
description Power noise is one of the key signal integrity problems. Unlike the design of signal paths, where the design rules in one product can often be applied to other products of similar bandwidth, the goal and constraints of designing power distribution network (PDN) can vary widely from product to product so design features of one product should not be applied to another product blindly. The primary purpose of PDN is to keep voltage constant across the pads of integrating circuits (ICs). The design of PDN also minimizes ground bounce and EMI problems. The main focus in this report is to understand the concept behind the design of a power distribution network and how each component play a role in ensuring power integrity (PI). An in-depth literature review on the various key components affecting PDN is first carried out. Next the identification of the design goal so that appropriate techniques can be applied to meet this criterion. Two major techniques are studied, including the using of decoupling where global utilizing large capacitance (4.7 µF) satisfy frequency below 30 MHz while local decoupling utilizing smaller capacitance (0.01 – 1 µF) are able to achieve up to 700 MHz. For higher frequency consideration, reducing the plane separation from 63 mils to 40 mils in PCB layer stack-up provides additional 5 – 10 dB impedance reduction.
author2 See Kye Yak
author_facet See Kye Yak
Toh, Tze Yan.
format Final Year Project
author Toh, Tze Yan.
author_sort Toh, Tze Yan.
title Study of power supply design for high speed circuit
title_short Study of power supply design for high speed circuit
title_full Study of power supply design for high speed circuit
title_fullStr Study of power supply design for high speed circuit
title_full_unstemmed Study of power supply design for high speed circuit
title_sort study of power supply design for high speed circuit
publishDate 2010
url http://hdl.handle.net/10356/40277
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