Mixed mode loading test and analysis on bonded joints
Solder joints are a common sight in electronic packaging which serves as mechanical and electrical interconnects in a package. Solder joints are prone to failure during a drop and the fracture behaviour and failure modes can differ under various loading conditions. The failure modes can var...
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| 格式: | Final Year Project |
| 語言: | English |
| 出版: |
2010
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| 在線閱讀: | http://hdl.handle.net/10356/40852 |
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| 機構: | Nanyang Technological University |
| 語言: | English |