Mixed mode loading test and analysis on bonded joints

• Main Author: Lim, Dao Hao.
• Other Authors: Pang Hock Lye, John
• Format: Final Year Project
• Language: English
• Published: 2010
• Subjects: DRNTU::Engineering::Mechanical engineering
• Online Access: http://hdl.handle.net/10356/40852
• Institution: Nanyang Technological University

Solder joints are a common sight in electronic packaging which serves as mechanical and electrical interconnects in a package. Solder joints are prone to failure during a drop and the fracture behaviour and failure modes can differ under various loading conditions. The failure modes can var...