Design and application of precision automation for various semiconductor electronic packaging technologies

Design and application of precision automation for various semiconductor electronic packaging technologies

The ongoing miniaturization together with the increasing functionality of electronic devices, for example, mobile phones, camcorders, laptops, etc, has forced the semiconductor industry to develop, in ever-shorter cycle, smaller and thinner devices. The trend to CSPs (chip scale package) is becoming...

Full description

Saved in:
Bibliographic Details
Main Author: Chew, Keng Hock.
Other Authors: Zhong, Zhaowei
Format: Theses and Dissertations
Published: 2008
Subjects:
DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging
Online Access:http://hdl.handle.net/10356/4128
Tags: Add Tag
No Tags, Be the first to tag this record!
Institution: Nanyang Technological University
id sg-ntu-dr.10356-4128
record_format dspace
spelling sg-ntu-dr.10356-41282023-07-04T15:44:30Z Design and application of precision automation for various semiconductor electronic packaging technologies Chew, Keng Hock. Zhong, Zhaowei School of Electrical and Electronic Engineering DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging The ongoing miniaturization together with the increasing functionality of electronic devices, for example, mobile phones, camcorders, laptops, etc, has forced the semiconductor industry to develop, in ever-shorter cycle, smaller and thinner devices. The trend to CSPs (chip scale package) is becoming more and more important. Master of Science (Precision Engineering) 2008-09-17T09:45:06Z 2008-09-17T09:45:06Z 2003 2003 Thesis http://hdl.handle.net/10356/4128 Nanyang Technological University application/pdf
institution Nanyang Technological University
building NTU Library
continent Asia
country Singapore
Singapore
content_provider NTU Library
collection DR-NTU
topic DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging
spellingShingle DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging
Chew, Keng Hock.
Design and application of precision automation for various semiconductor electronic packaging technologies
description The ongoing miniaturization together with the increasing functionality of electronic devices, for example, mobile phones, camcorders, laptops, etc, has forced the semiconductor industry to develop, in ever-shorter cycle, smaller and thinner devices. The trend to CSPs (chip scale package) is becoming more and more important.
author2 Zhong, Zhaowei
author_facet Zhong, Zhaowei
Chew, Keng Hock.
format Theses and Dissertations
author Chew, Keng Hock.
author_sort Chew, Keng Hock.
title Design and application of precision automation for various semiconductor electronic packaging technologies
title_short Design and application of precision automation for various semiconductor electronic packaging technologies
title_full Design and application of precision automation for various semiconductor electronic packaging technologies
title_fullStr Design and application of precision automation for various semiconductor electronic packaging technologies
title_full_unstemmed Design and application of precision automation for various semiconductor electronic packaging technologies
title_sort design and application of precision automation for various semiconductor electronic packaging technologies
publishDate 2008
url http://hdl.handle.net/10356/4128
_version_ 1772828007411482624

Similar Items