Quality improvement for molding process

Molding process is a process of fixing the molding compound onto the substrate to make the IC body. From the analyses of the current quality practice in company, it was found that the main defects associated with the molding process were substrate crack, mold bleed and wire sweep. The main proble...

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Main Author: Yang, Chang Cheng
Other Authors: Lam Yee Cheong
Format: Theses and Dissertations
Language:English
Published: 2010
Subjects:
Online Access:http://hdl.handle.net/10356/41579
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Institution: Nanyang Technological University
Language: English
id sg-ntu-dr.10356-41579
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spelling sg-ntu-dr.10356-415792023-03-11T17:02:11Z Quality improvement for molding process Yang, Chang Cheng Lam Yee Cheong School of Mechanical and Aerospace Engineering DRNTU::Engineering::Manufacturing::Quality control Molding process is a process of fixing the molding compound onto the substrate to make the IC body. From the analyses of the current quality practice in company, it was found that the main defects associated with the molding process were substrate crack, mold bleed and wire sweep. The main problems which caused these defects were solder mask cannot withstand molding machine pressure; substrate thickness variation caused mold bleed in one direction; and susbstrate warpage caused wire sweep. Master of Science (Mechanics & Processing of Materials) 2010-07-21T08:42:03Z 2010-07-21T08:42:03Z 2008 2008 Thesis http://hdl.handle.net/10356/41579 en 75 p. application/pdf
institution Nanyang Technological University
building NTU Library
continent Asia
country Singapore
Singapore
content_provider NTU Library
collection DR-NTU
language English
topic DRNTU::Engineering::Manufacturing::Quality control
spellingShingle DRNTU::Engineering::Manufacturing::Quality control
Yang, Chang Cheng
Quality improvement for molding process
description Molding process is a process of fixing the molding compound onto the substrate to make the IC body. From the analyses of the current quality practice in company, it was found that the main defects associated with the molding process were substrate crack, mold bleed and wire sweep. The main problems which caused these defects were solder mask cannot withstand molding machine pressure; substrate thickness variation caused mold bleed in one direction; and susbstrate warpage caused wire sweep.
author2 Lam Yee Cheong
author_facet Lam Yee Cheong
Yang, Chang Cheng
format Theses and Dissertations
author Yang, Chang Cheng
author_sort Yang, Chang Cheng
title Quality improvement for molding process
title_short Quality improvement for molding process
title_full Quality improvement for molding process
title_fullStr Quality improvement for molding process
title_full_unstemmed Quality improvement for molding process
title_sort quality improvement for molding process
publishDate 2010
url http://hdl.handle.net/10356/41579
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