Solid state diffusion bonding of superalloy X-750 in air ambience

Conventional diffusion bonding processes require a vacuum ambience. This results in high production cost and other disadvantages and limits its application. Therefore, alternative bonding methods have been sought by researchers for a long time. In this study, a novel form of diffusion bonding was pr...

Full description

Saved in:
Bibliographic Details
Main Author: Dong, Guo Ming
Other Authors: Roop Singh Chandel
Format: Theses and Dissertations
Language:English
Published: 2011
Subjects:
Online Access:http://hdl.handle.net/10356/42605
Tags: Add Tag
No Tags, Be the first to tag this record!
Institution: Nanyang Technological University
Language: English