Studying of kissing bond using scanning acoustic microscope

• Main Author: Tan, Yong Kang.
• Other Authors: Wong, Brian Stephen
• Format: Final Year Project
• Language: English
• Published: 2011
• Subjects: DRNTU::Engineering::Mechanical engineering
• Online Access: http://hdl.handle.net/10356/44592
• Institution: Nanyang Technological University

Kissing bond is an adhesive bonding defect and is thought to arise from either contamination of the surfaces during manufacture or various forms of environmental attack. It is especially dangerous because it is often the likely cause for premature failure in the adhesive joints. Hence, there is a ne...