Studying of kissing bond using scanning acoustic microscope

• Main Author: Tan, Yong Kang.
• Other Authors: Wong, Brian Stephen
• Format: Final Year Project
• Language: English
• Published: 2011
• Subjects: DRNTU::Engineering::Mechanical engineering
• Online Access: http://hdl.handle.net/10356/44592
• Institution: Nanyang Technological University

Kissing bond is an adhesive bonding defect and is thought to arise from either contamination of the surfaces during manufacture or various forms of environmental attack. It is especially dangerous because it is often the likely cause for premature failure in the adhesive joints. Hence, there is a need to detect this defect in the earlier stage of manufacturing. This report presents the study of kissing bond and its detectability using a non-destructive technique, namely, the Scanning Acoustic Microscopy (S.A.M). The background of this technique and the procedures that are undertaken for the project have been allocated in a chapter to aid the readers in the understanding of the project. Using S.A.M, the images of the defect and the velocity of the surface acoustic waves are obtained through the usage of the point-focus acoustic microscopy. Using the V(z) technique, the V(z) curve and the Rayleigh velocities were measured and used to characterize the properties of the kissing bond that is created under different conditions. The results show that S.A.M is able to detect the defect accurately and characterize its bond strength quantitatively. In addition, the effects of the torque applied on the dry kissing bonds were also studied in this project. Lastly, various factors affecting the accuracy of the measurements were also discussed in this project. In the end of this report, some recommendations were made for the future project to improve the accuracy of the experimental results.