Optical system for camera flip chip application
Design an imaging system based on thermoset material and study the tolerance sensitivity of the imaging system. The potential basic configuration of the lens system is found. The optical properties of a new thermoset material developed by the collaborator is measured and analyzed.
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2008
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sg-ntu-dr.10356-49512023-07-04T15:29:05Z Optical system for camera flip chip application Ng, Keh Chyun. Chen, George Chung Kit School of Electrical and Electronic Engineering Sun, Xiaowei DRNTU::Engineering::Electrical and electronic engineering::Optics, optoelectronics, photonics Design an imaging system based on thermoset material and study the tolerance sensitivity of the imaging system. The potential basic configuration of the lens system is found. The optical properties of a new thermoset material developed by the collaborator is measured and analyzed. Master of Science (Photonics) 2008-09-17T10:02:05Z 2008-09-17T10:02:05Z 2004 2004 Thesis http://hdl.handle.net/10356/4951 Nanyang Technological University application/pdf |
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DRNTU::Engineering::Electrical and electronic engineering::Optics, optoelectronics, photonics Ng, Keh Chyun. Optical system for camera flip chip application |
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Design an imaging system based on thermoset material and study the tolerance sensitivity of the imaging system. The potential basic configuration of the lens system is found. The optical properties of a new thermoset material developed by the collaborator is measured and analyzed. |
author2 |
Chen, George Chung Kit |
author_facet |
Chen, George Chung Kit Ng, Keh Chyun. |
format |
Theses and Dissertations |
author |
Ng, Keh Chyun. |
author_sort |
Ng, Keh Chyun. |
title |
Optical system for camera flip chip application |
title_short |
Optical system for camera flip chip application |
title_full |
Optical system for camera flip chip application |
title_fullStr |
Optical system for camera flip chip application |
title_full_unstemmed |
Optical system for camera flip chip application |
title_sort |
optical system for camera flip chip application |
publishDate |
2008 |
url |
http://hdl.handle.net/10356/4951 |
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1772828597544812544 |