Bonding of micro devices
In recent years, bonding device has evolved from small application such as toys to big application such as cars. Materials to be used has been changed from glass in the past to current thermoplastic such as Poly(methyl Methacrylate) PMMA for its durability and other characteristic.
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Main Author: | Peh, Chow Keong. |
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Other Authors: | Tor Shu Beng |
Format: | Final Year Project |
Language: | English |
Published: |
2012
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Subjects: | |
Online Access: | http://hdl.handle.net/10356/50340 |
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Institution: | Nanyang Technological University |
Language: | English |
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