Structures and properties of thermally conductive thermoplastic composites

• المؤلف الرئيسي: Ng, Hsiao Yen.
• مؤلفون آخرون: Lu Xuehong.
• التنسيق: Theses and Dissertations
• اللغة: English
• منشور في: 2008
• الموضوعات: DRNTU::Engineering::Materials::Composite materials
• الوصول للمادة أونلاين: http://hdl.handle.net/10356/5095

Formulate thermoplastic composites that offer high thermal conductivity and good electrical insulating properties for electronic packaging purposes. Examine other important properties such as rheological properties (ease of processing) and the mechanical properties (end use performance).