Development of a software protection scheme for the die attach equipment

• Main Author: Wong, Goul Ney.
• Other Authors: Seet, Gerald Gim Lee
• Format: Theses and Dissertations
• Published: 2008
• Subjects: DRNTU::Engineering::Manufacturing
• Online Access: http://hdl.handle.net/10356/5383
• Institution: Nanyang Technological University

European Semiconductor Equipment Company (ESEC) is ranked as the No. 1 die attach equipment maker in the world, in terms of market share. At ESEC, the die attach equipment or the Die Bonders are build on an expandable platform concept. The equipment are built based on one base-configuration with add...