Quality and process improvement of die and glass attach operation for smart optical package (SmOP)
The purpose of this work is to study and evaluate in detail the quality control of the image sensors assembly process as well as to improve the process capability. The die and glass attachment process is one of the major contributors to daily production yield loss. Thus, this work covers the die and...
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| Format: | Theses and Dissertations |
| Published: |
2008
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| Online Access: | http://hdl.handle.net/10356/6446 |
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| Institution: | Nanyang Technological University |