Ultrasonic bonding of thermoplastic microfluidic devices
Microfluidic devices see many advantages in using plastics that include low cost and easily available manufacturing methods, as compared to glass and silicon. Regardless of the bonding method, mass manufacturing development always imposes a unique set of challenge to overcome. Ultrasonic wel...
Saved in:
Main Author: | Ngooi, Yaohe. |
---|---|
Other Authors: | Tor Shu Beng |
Format: | Final Year Project |
Language: | English |
Published: |
2013
|
Subjects: | |
Online Access: | http://hdl.handle.net/10356/54097 |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Institution: | Nanyang Technological University |
Language: | English |
Similar Items
-
Molding and bonding of thermoplastic microfluidic devices
by: Yu, Hao
Published: (2015) -
Modeling and monitoring of ultrasonic welding of thermoplastics
by: Luan, Jingen.
Published: (2008) -
Process and mechanism of ultrasonic welding of thermoplastics
by: Li, Xiangchao
Published: (2008) -
Three-dimensional model for thermoplastic composites pultrusion
by: Feroz Ahmed
Published: (2008) -
Robustness of FE/NCV modeling of thermoplastic composites pultrusion
by: Alagu Thirunavirkarasu
Published: (2008)