Heat dissipation in ball grid array packages

This thesis discusses the issue of thermal management in typical Ball Grid Array (BGA) packages. It aims to study the behavior of heat dissipation in a single BGA solder joint as well as multiple solder joints through the use of analytical, numerical and experimental techniques. Important factors th...

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Bibliographic Details
Main Author:	Ying, Teck Mun.
Other Authors:	Toh, Kok Chuan
Format:	Theses and Dissertations
Published:	2008
Subjects:	DRNTU::Engineering::Mechanical engineering
Online Access:	http://hdl.handle.net/10356/5485
Tags:	Add Tag No Tags, Be the first to tag this record!
Institution:	Nanyang Technological University

id	sg-ntu-dr.10356-5485
record_format	dspace
spelling	sg-ntu-dr.10356-54852023-03-11T16:58:08Z Heat dissipation in ball grid array packages Ying, Teck Mun. Toh, Kok Chuan School of Mechanical and Production Engineering DRNTU::Engineering::Mechanical engineering This thesis discusses the issue of thermal management in typical Ball Grid Array (BGA) packages. It aims to study the behavior of heat dissipation in a single BGA solder joint as well as multiple solder joints through the use of analytical, numerical and experimental techniques. Important factors that contribute to the heat dissipation of BGA packages are analyzed and discussed. Such factors include geometrical condition, material properties and thermal loading on the BGA package. Master of Engineering (MPE) 2008-09-17T10:51:45Z 2008-09-17T10:51:45Z 2000 2000 Thesis http://hdl.handle.net/10356/5485 Nanyang Technological University application/pdf
institution	Nanyang Technological University
building	NTU Library
continent	Asia
country	Singapore Singapore
content_provider	NTU Library
collection	DR-NTU
topic	DRNTU::Engineering::Mechanical engineering
spellingShingle	DRNTU::Engineering::Mechanical engineering Ying, Teck Mun. Heat dissipation in ball grid array packages
description	This thesis discusses the issue of thermal management in typical Ball Grid Array (BGA) packages. It aims to study the behavior of heat dissipation in a single BGA solder joint as well as multiple solder joints through the use of analytical, numerical and experimental techniques. Important factors that contribute to the heat dissipation of BGA packages are analyzed and discussed. Such factors include geometrical condition, material properties and thermal loading on the BGA package.
author2	Toh, Kok Chuan
author_facet	Toh, Kok Chuan Ying, Teck Mun.
format	Theses and Dissertations
author	Ying, Teck Mun.
author_sort	Ying, Teck Mun.
title	Heat dissipation in ball grid array packages
title_short	Heat dissipation in ball grid array packages
title_full	Heat dissipation in ball grid array packages
title_fullStr	Heat dissipation in ball grid array packages
title_full_unstemmed	Heat dissipation in ball grid array packages
title_sort	heat dissipation in ball grid array packages
publishDate	2008
url	http://hdl.handle.net/10356/5485
_version_	1761782076974039040

Heat dissipation in ball grid array packages

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