Development of micromolding process

In this research work, the software MOLDFLOW (Release 1.1, Build 00055) was used for the simulation of the micromolding process. High- and low-density polyethylene (HDPE, LLDPE) were selected for the study.

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Main Author: Yuan, Sen.
Other Authors: Hung, Wayne N. P.
Format: Theses and Dissertations
Published: 2008
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Online Access:http://hdl.handle.net/10356/5502
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Institution: Nanyang Technological University
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spelling sg-ntu-dr.10356-55022023-03-11T17:09:19Z Development of micromolding process Yuan, Sen. Hung, Wayne N. P. School of Mechanical and Production Engineering DRNTU::Engineering::Manufacturing In this research work, the software MOLDFLOW (Release 1.1, Build 00055) was used for the simulation of the micromolding process. High- and low-density polyethylene (HDPE, LLDPE) were selected for the study. Master of Engineering (MPE) 2008-09-17T10:52:13Z 2008-09-17T10:52:13Z 2002 2002 Thesis http://hdl.handle.net/10356/5502 Nanyang Technological University application/pdf
institution Nanyang Technological University
building NTU Library
continent Asia
country Singapore
Singapore
content_provider NTU Library
collection DR-NTU
topic DRNTU::Engineering::Manufacturing
spellingShingle DRNTU::Engineering::Manufacturing
Yuan, Sen.
Development of micromolding process
description In this research work, the software MOLDFLOW (Release 1.1, Build 00055) was used for the simulation of the micromolding process. High- and low-density polyethylene (HDPE, LLDPE) were selected for the study.
author2 Hung, Wayne N. P.
author_facet Hung, Wayne N. P.
Yuan, Sen.
format Theses and Dissertations
author Yuan, Sen.
author_sort Yuan, Sen.
title Development of micromolding process
title_short Development of micromolding process
title_full Development of micromolding process
title_fullStr Development of micromolding process
title_full_unstemmed Development of micromolding process
title_sort development of micromolding process
publishDate 2008
url http://hdl.handle.net/10356/5502
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