Development of micromolding process
In this research work, the software MOLDFLOW (Release 1.1, Build 00055) was used for the simulation of the micromolding process. High- and low-density polyethylene (HDPE, LLDPE) were selected for the study.
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Main Author: | Yuan, Sen. |
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Other Authors: | Hung, Wayne N. P. |
Format: | Theses and Dissertations |
Published: |
2008
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Subjects: | |
Online Access: | http://hdl.handle.net/10356/5502 |
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Institution: | Nanyang Technological University |
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