Study of mechanism of ultrasonic wire bonding process

In this study, a sensing cum actuating (SCA) technique is developed to study the wire bonding system. The actuating mechanism of a wire bonder is viewed as an SCA device which possesses an unique transduction matrix correlating the electrical input variables of the PZT driver and the mechanical outp...

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Bibliographic Details
Main Author:	Zhang, Dong
Other Authors:	Ling, Shih Fu
Format:	Theses and Dissertations
Published:	2008
Subjects:	DRNTU::Engineering::Manufacturing
Online Access:	http://hdl.handle.net/10356/5516
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Institution:	Nanyang Technological University

id	sg-ntu-dr.10356-5516
record_format	dspace
spelling	sg-ntu-dr.10356-55162023-03-11T17:10:57Z Study of mechanism of ultrasonic wire bonding process Zhang, Dong Ling, Shih Fu School of Mechanical and Production Engineering DRNTU::Engineering::Manufacturing In this study, a sensing cum actuating (SCA) technique is developed to study the wire bonding system. The actuating mechanism of a wire bonder is viewed as an SCA device which possesses an unique transduction matrix correlating the electrical input variables of the PZT driver and the mechanical output variables at the tip of the capillary. The transduction matrix is identified experimentally. Thus, the force and velocity at the tip of the capillary is first time obtained from the input voltage and current of the PZT driver. Doctor of Philosophy (MPE) 2008-09-17T10:52:31Z 2008-09-17T10:52:31Z 2003 2003 Thesis http://hdl.handle.net/10356/5516 Nanyang Technological University application/pdf
institution	Nanyang Technological University
building	NTU Library
continent	Asia
country	Singapore Singapore
content_provider	NTU Library
collection	DR-NTU
topic	DRNTU::Engineering::Manufacturing
spellingShingle	DRNTU::Engineering::Manufacturing Zhang, Dong Study of mechanism of ultrasonic wire bonding process
description	In this study, a sensing cum actuating (SCA) technique is developed to study the wire bonding system. The actuating mechanism of a wire bonder is viewed as an SCA device which possesses an unique transduction matrix correlating the electrical input variables of the PZT driver and the mechanical output variables at the tip of the capillary. The transduction matrix is identified experimentally. Thus, the force and velocity at the tip of the capillary is first time obtained from the input voltage and current of the PZT driver.
author2	Ling, Shih Fu
author_facet	Ling, Shih Fu Zhang, Dong
format	Theses and Dissertations
author	Zhang, Dong
author_sort	Zhang, Dong
title	Study of mechanism of ultrasonic wire bonding process
title_short	Study of mechanism of ultrasonic wire bonding process
title_full	Study of mechanism of ultrasonic wire bonding process
title_fullStr	Study of mechanism of ultrasonic wire bonding process
title_full_unstemmed	Study of mechanism of ultrasonic wire bonding process
title_sort	study of mechanism of ultrasonic wire bonding process
publishDate	2008
url	http://hdl.handle.net/10356/5516
_version_	1761781682489262080

Study of mechanism of ultrasonic wire bonding process

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