Study of mechanism of ultrasonic wire bonding process
In this study, a sensing cum actuating (SCA) technique is developed to study the wire bonding system. The actuating mechanism of a wire bonder is viewed as an SCA device which possesses an unique transduction matrix correlating the electrical input variables of the PZT driver and the mechanical outp...
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| Format: | Theses and Dissertations |
| Published: |
2008
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| Online Access: | http://hdl.handle.net/10356/5516 |
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| Institution: | Nanyang Technological University |
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