Accelerated electron beam curable resin systems for microelectronics application
Increasing application in the aerospace and microelectronics industries has led to the demand for accelerated curing of high performance structural adhesive systems such as epoxy. Particularly for the microelectronics industry, the curing of thermoset systems has become the bottleneck of the whole p...
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| Format: | Theses and Dissertations |
| Published: |
2008
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| Online Access: | http://hdl.handle.net/10356/5611 |
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| Institution: | Nanyang Technological University |
| Summary: | Increasing application in the aerospace and microelectronics industries has led to the demand for accelerated curing of high performance structural adhesive systems such as epoxy. Particularly for the microelectronics industry, the curing of thermoset systems has become the bottleneck of the whole production process. Alternative accelerated curing systems like ultraviolet light and gamma rays have been limited by their respective disadvantages in poor depth penetration and safety consideration. More recently electron beam radiation curing has been shown to be a viable alternative as an accelerated curing system. EB curing of coatings has several advantages over conventional thermal curing methods including considerably reduced cure times, curing at low temperature and reduced thermal stresses in the coatings. This thesis reports the application of low energy e-beam system to cure epoxy coatings at ambient. |
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