Total fab monitoring tool (TFM) for a semiconductor company

The report presents the overview of how the Total Fab Monitoring Tool (TFM) is implemented in the author's company - Infineon Technologies.

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Bibliographic Details
Main Author: Chua, Yong Chin.
Other Authors: Jiao, Roger Jianxin
Format: Theses and Dissertations
Published: 2008
Subjects:
Online Access:http://hdl.handle.net/10356/5658
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Institution: Nanyang Technological University
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spelling sg-ntu-dr.10356-56582023-03-11T17:08:48Z Total fab monitoring tool (TFM) for a semiconductor company Chua, Yong Chin. Jiao, Roger Jianxin School of Mechanical and Aerospace Engineering DRNTU::Engineering::Manufacturing The report presents the overview of how the Total Fab Monitoring Tool (TFM) is implemented in the author's company - Infineon Technologies. Master of Science (Computer Integrated Manufacturing) 2008-09-17T10:55:59Z 2008-09-17T10:55:59Z 2005 2005 Thesis http://hdl.handle.net/10356/5658 Nanyang Technological University application/pdf
institution Nanyang Technological University
building NTU Library
continent Asia
country Singapore
Singapore
content_provider NTU Library
collection DR-NTU
topic DRNTU::Engineering::Manufacturing
spellingShingle DRNTU::Engineering::Manufacturing
Chua, Yong Chin.
Total fab monitoring tool (TFM) for a semiconductor company
description The report presents the overview of how the Total Fab Monitoring Tool (TFM) is implemented in the author's company - Infineon Technologies.
author2 Jiao, Roger Jianxin
author_facet Jiao, Roger Jianxin
Chua, Yong Chin.
format Theses and Dissertations
author Chua, Yong Chin.
author_sort Chua, Yong Chin.
title Total fab monitoring tool (TFM) for a semiconductor company
title_short Total fab monitoring tool (TFM) for a semiconductor company
title_full Total fab monitoring tool (TFM) for a semiconductor company
title_fullStr Total fab monitoring tool (TFM) for a semiconductor company
title_full_unstemmed Total fab monitoring tool (TFM) for a semiconductor company
title_sort total fab monitoring tool (tfm) for a semiconductor company
publishDate 2008
url http://hdl.handle.net/10356/5658
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