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Modeling and simulation of drop behaviour of multipack products

In this project, finite element modeling procedure is developed to conduct drop impact simulation on four packaging materials using Ansys (LS Dyna). The corresponding cushioning curves for the materials are obtained in which the package is then designed.

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書目詳細資料
主要作者: Kambhampati Venugopal.
其他作者: Lye, Sun Woh
格式: Theses and Dissertations
出版: 2008
主題:
在線閱讀:http://hdl.handle.net/10356/5853
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