Synthesis of borate-based epoxy molding compound for radiation hardened electronics packaging

• Main Author: Muhammad Ridhwan Md Yusoff
• Other Authors: Gan Chee Lip
• Format: Final Year Project
• Language: English
• Published: 2014
• Subjects: DRNTU::Engineering
• Online Access: http://hdl.handle.net/10356/59591
• Institution: Nanyang Technological University

Recently, considerable attention has been focused on the development of a new class of shielding material made from a mixture of epoxy resin and boron oxide (B2O3). This material exhibits better shielding performance than existing materials thus making it suitable for use in radiation machineries an...