Calibration of ASIC for pressure sensors

Modern circuitry systems have brought thermal issues into the spotlight due to increases in circuit density and complexity of components. Previous research has indicated that the thermal problem can cause significant performance decay as well as reducing of circuitry reliability.[1] As such, tempera...

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Bibliographic Details
Main Author: Qin, Tianhe
Other Authors: Goh Wang Ling
Format: Final Year Project
Language:English
Published: 2014
Subjects:
Online Access:http://hdl.handle.net/10356/60422
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Institution: Nanyang Technological University
Language: English