Calibration of ASIC for pressure sensors
Modern circuitry systems have brought thermal issues into the spotlight due to increases in circuit density and complexity of components. Previous research has indicated that the thermal problem can cause significant performance decay as well as reducing of circuitry reliability.[1] As such, tempera...
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Main Author: | Qin, Tianhe |
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Other Authors: | Goh Wang Ling |
Format: | Final Year Project |
Language: | English |
Published: |
2014
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Subjects: | |
Online Access: | http://hdl.handle.net/10356/60422 |
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Institution: | Nanyang Technological University |
Language: | English |
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