Rapid thermal annealing for ultra-shallow junction in deep submicron CMOS integrated circuits

• المؤلف الرئيسي: Qin, Fei Tao
• مؤلفون آخرون: Lau Wai Shing
• التنسيق: Theses and Dissertations
• اللغة: English
• منشور في: 2009
• الموضوعات: DRNTU::Engineering::Electrical and electronic engineering::Integrated circuits
• الوصول للمادة أونلاين: http://hdl.handle.net/10356/19276
• المؤسسة: Nanyang Technological University

In this MSC dissertation, the focus of the study has been on the effect of critical parameters of rapid thermal anneal on shallow implants for ultra-shallow junction formation. Spike anneal was found to be more effective than soak anneal for ultra-shallow function formation.