Development of copper metallization for Deep Submicron Integrated Circuits (DSICs)

• Main Authors: Krishnamachar Prasad, Zhang, Dao Hua, Tan, Cher Ming
• Other Authors: School of Electrical and Electronic Engineering
• Format: Research Report
• Published: 2008
• Subjects: DRNTU::Engineering::Electrical and electronic engineering::Integrated circuits
• Online Access: http://hdl.handle.net/10356/2896
• Institution: Nanyang Technological University

The development of copper metallization for deep submicron integrated circuits (DSICs) was a project jointly funded by the Ministry of Education (MoE) and the Agency for Science Technology and Research (A*STAR). Being a very broad based project, the report is deliberately divided into 3 parts. Each...