Development of copper metallization for Deep Submicron Integrated Circuits (DSICs)

The development of copper metallization for deep submicron integrated circuits (DSICs) was a project jointly funded by the Ministry of Education (MoE) and the Agency for Science Technology and Research (A*STAR). Being a very broad based project, the report is deliberately divided into 3 parts. Each...

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Main Authors:	Krishnamachar Prasad, Zhang, Dao Hua, Tan, Cher Ming
Other Authors:	School of Electrical and Electronic Engineering
Format:	Research Report
Published:	2008
Subjects:	DRNTU::Engineering::Electrical and electronic engineering::Integrated circuits
Online Access:	http://hdl.handle.net/10356/2896
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Institution:	Nanyang Technological University

id	sg-ntu-dr.10356-2896
record_format	dspace
spelling	sg-ntu-dr.10356-28962023-03-04T03:19:30Z Development of copper metallization for Deep Submicron Integrated Circuits (DSICs) Krishnamachar Prasad Zhang, Dao Hua Tan, Cher Ming School of Electrical and Electronic Engineering DRNTU::Engineering::Electrical and electronic engineering::Integrated circuits The development of copper metallization for deep submicron integrated circuits (DSICs) was a project jointly funded by the Ministry of Education (MoE) and the Agency for Science Technology and Research (A*STAR). Being a very broad based project, the report is deliberately divided into 3 parts. Each part is a complete report by itself - complete with summary, table of contents and various chapters. The 3 parts are identified as follows: 2008-09-17T09:16:32Z 2008-09-17T09:16:32Z 2004 2004 Research Report http://hdl.handle.net/10356/2896 Nanyang Technological University application/pdf
institution	Nanyang Technological University
building	NTU Library
continent	Asia
country	Singapore Singapore
content_provider	NTU Library
collection	DR-NTU
topic	DRNTU::Engineering::Electrical and electronic engineering::Integrated circuits
spellingShingle	DRNTU::Engineering::Electrical and electronic engineering::Integrated circuits Krishnamachar Prasad Zhang, Dao Hua Tan, Cher Ming Development of copper metallization for Deep Submicron Integrated Circuits (DSICs)
description	The development of copper metallization for deep submicron integrated circuits (DSICs) was a project jointly funded by the Ministry of Education (MoE) and the Agency for Science Technology and Research (A*STAR). Being a very broad based project, the report is deliberately divided into 3 parts. Each part is a complete report by itself - complete with summary, table of contents and various chapters. The 3 parts are identified as follows:
author2	School of Electrical and Electronic Engineering
author_facet	School of Electrical and Electronic Engineering Krishnamachar Prasad Zhang, Dao Hua Tan, Cher Ming
format	Research Report
author	Krishnamachar Prasad Zhang, Dao Hua Tan, Cher Ming
author_sort	Krishnamachar Prasad
title	Development of copper metallization for Deep Submicron Integrated Circuits (DSICs)
title_short	Development of copper metallization for Deep Submicron Integrated Circuits (DSICs)
title_full	Development of copper metallization for Deep Submicron Integrated Circuits (DSICs)
title_fullStr	Development of copper metallization for Deep Submicron Integrated Circuits (DSICs)
title_full_unstemmed	Development of copper metallization for Deep Submicron Integrated Circuits (DSICs)
title_sort	development of copper metallization for deep submicron integrated circuits (dsics)
publishDate	2008
url	http://hdl.handle.net/10356/2896
_version_	1759853329493524480

Development of copper metallization for Deep Submicron Integrated Circuits (DSICs)

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