Development of copper metallization for Deep Submicron Integrated Circuits (DSICs)
The development of copper metallization for deep submicron integrated circuits (DSICs) was a project jointly funded by the Ministry of Education (MoE) and the Agency for Science Technology and Research (A*STAR). Being a very broad based project, the report is deliberately divided into 3 parts. Each...
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| Main Authors: | , , |
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| Other Authors: | |
| Format: | Research Report |
| Published: |
2008
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| Subjects: | |
| Online Access: | http://hdl.handle.net/10356/2896 |
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| Institution: | Nanyang Technological University |
| Summary: | The development of copper metallization for deep submicron integrated circuits (DSICs) was a project jointly funded by the Ministry of Education (MoE) and the Agency for Science Technology and Research (A*STAR).
Being a very broad based project, the report is deliberately divided into 3 parts. Each part is a complete report by itself - complete with summary, table of contents and various chapters. The 3 parts are identified as follows: |
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