A study on electromigration by driving force approach for submicron copper interconnect

The prime interest of this thesis work is to investigate the physics of electromigration failure in submicron Cu interconnections including the effect of surrounding materials. A combined driving force model, including the forces from the stress and temperature gradients is presented. Experiments ar...

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Bibliographic Details
Main Author: Roy, Arijit
Other Authors: Tan Cher Ming
Format: Theses and Dissertations
Published: 2008
Subjects:
Online Access:https://hdl.handle.net/10356/3479
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Institution: Nanyang Technological University