A study on electromigration by driving force approach for submicron copper interconnect

• المؤلف الرئيسي: Roy, Arijit
• مؤلفون آخرون: Tan Cher Ming
• التنسيق: Theses and Dissertations
• منشور في: 2008
• الموضوعات: DRNTU::Engineering::Electrical and electronic engineering::Integrated circuits
• الوصول للمادة أونلاين: https://hdl.handle.net/10356/3479
• المؤسسة: Nanyang Technological University

The prime interest of this thesis work is to investigate the physics of electromigration failure in submicron Cu interconnections including the effect of surrounding materials. A combined driving force model, including the forces from the stress and temperature gradients is presented. Experiments ar...