Characterization of Cu-Sn-In thin films for three-dimensional heterogeneous system integration
Cu/Sn-In solder thin films were studied as a low temperature bonding material for 3D heterogeneous system integration. A new technique based on observation of color changes and combinatorial deposition of solder thin films was developed to investigate the intermetallic compound (IMC) growth kinetics...
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| 格式: | Theses and Dissertations |
| 語言: | English |
| 出版: |
2014
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| 主題: | |
| 在線閱讀: | https://hdl.handle.net/10356/60524 |
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| 機構: | Nanyang Technological University |
| 語言: | English |