Optimization of micro hot embossing process for manufacturing polymeric microfluidic devices with aluminum alloy die

This project focuses on optimizing the micro hot embossing process of transferring micro features from an aluminum mold to a polymer substrate of COC with high fidelity. Effects on replication errors of parameters such as embossing temperature, load, holding time, and demolding temperature, were exa...

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主要作者: Dong, Youqun
其他作者: Lam Yee Cheong
格式: Theses and Dissertations
語言:English
出版: 2014
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在線閱讀:http://hdl.handle.net/10356/60578
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機構: Nanyang Technological University
語言: English
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spelling sg-ntu-dr.10356-605782020-11-01T11:29:32Z Optimization of micro hot embossing process for manufacturing polymeric microfluidic devices with aluminum alloy die Dong, Youqun Lam Yee Cheong School of Mechanical and Aerospace Engineering Singapore-MIT Alliance Programme DRNTU::Engineering::Manufacturing This project focuses on optimizing the micro hot embossing process of transferring micro features from an aluminum mold to a polymer substrate of COC with high fidelity. Effects on replication errors of parameters such as embossing temperature, load, holding time, and demolding temperature, were examined by design of experiment, the replication errors during this hot embossing process were modeled by response surface modeling, and optimal hot embossing process conditions were identified by analysis of the developed response surface models. It was found that temperature and load are the two most significant parameters for hot embossing. The orientation of the micro features with respect to the substrate material flow has influence on the width replication of the channels, which suggests that the property of the surface layer of COC substrate is anisotropic. ​Master of Science (IMST) 2014-05-28T08:15:33Z 2014-05-28T08:15:33Z 2009 2009 Thesis http://hdl.handle.net/10356/60578 en 69 p. application/pdf
institution Nanyang Technological University
building NTU Library
continent Asia
country Singapore
Singapore
content_provider NTU Library
collection DR-NTU
language English
topic DRNTU::Engineering::Manufacturing
spellingShingle DRNTU::Engineering::Manufacturing
Dong, Youqun
Optimization of micro hot embossing process for manufacturing polymeric microfluidic devices with aluminum alloy die
description This project focuses on optimizing the micro hot embossing process of transferring micro features from an aluminum mold to a polymer substrate of COC with high fidelity. Effects on replication errors of parameters such as embossing temperature, load, holding time, and demolding temperature, were examined by design of experiment, the replication errors during this hot embossing process were modeled by response surface modeling, and optimal hot embossing process conditions were identified by analysis of the developed response surface models. It was found that temperature and load are the two most significant parameters for hot embossing. The orientation of the micro features with respect to the substrate material flow has influence on the width replication of the channels, which suggests that the property of the surface layer of COC substrate is anisotropic.
author2 Lam Yee Cheong
author_facet Lam Yee Cheong
Dong, Youqun
format Theses and Dissertations
author Dong, Youqun
author_sort Dong, Youqun
title Optimization of micro hot embossing process for manufacturing polymeric microfluidic devices with aluminum alloy die
title_short Optimization of micro hot embossing process for manufacturing polymeric microfluidic devices with aluminum alloy die
title_full Optimization of micro hot embossing process for manufacturing polymeric microfluidic devices with aluminum alloy die
title_fullStr Optimization of micro hot embossing process for manufacturing polymeric microfluidic devices with aluminum alloy die
title_full_unstemmed Optimization of micro hot embossing process for manufacturing polymeric microfluidic devices with aluminum alloy die
title_sort optimization of micro hot embossing process for manufacturing polymeric microfluidic devices with aluminum alloy die
publishDate 2014
url http://hdl.handle.net/10356/60578
_version_ 1688654674071126016