Thermal bonding and surface modification in the fabrication of COC polymer based microfluidic devices
Cyclic olefin copolymers (COC) are commonly used in the fabrication of microfluidic devices. Several issues need to be addressed before this can be realized. A fundamental understanding of the factors that affect thermal bond strength between different polymer substrates is necessary.This will enabl...
Saved in:
Main Author: | Roy, Sunanda |
---|---|
Other Authors: | Yue Chee Yoon |
Format: | Theses and Dissertations |
Language: | English |
Published: |
2014
|
Subjects: | |
Online Access: | http://hdl.handle.net/10356/60586 |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Institution: | Nanyang Technological University |
Language: | English |
Similar Items
-
Fabrication of cyclic olefin copolymer (COC/TOPAS) microfluidic devices: hot embossing and thermal bonding
by: Jena, Rajeeb Kumar
Published: (2014) -
Polymer microfluidic devices : thermo-mechanical properties of COC polymer
by: Oo, William Yue Lin.
Published: (2010) -
Polymer based micro-fluidic devices : improvement in thermal bond strength of COC micofluidic device using photografting technique
by: Tan, Hsien Tat.
Published: (2011) -
Ultrasonic bonding of microfluidic devices
by: Tan, Wei Yung
Published: (2014) -
Polymer microfluidic devices : sealing and lamination of topas microfluidic devices by thermal bonding
by: Li, Aaron Shi Wei.
Published: (2010)