Thermal management of 3D integrated circuits with microchannel-based liquid cooling

• Main Author: Qian, Hanhua
• Other Authors: Chang, Chip Hong
• Format: Theses and Dissertations
• Language: English
• Published: 2014
• Subjects: DRNTU::Engineering::Electrical and electronic engineering::Electronic circuits; DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging; DRNTU::Engineering::Electrical and electronic engineering::Integrated circuits
• Online Access: https://hdl.handle.net/10356/61034
• Institution: Nanyang Technological University

The emerging three dimensional integrated circuit (3DIC) technology has offered promising solutions to problems faced by today’s 2D large-scale-integration (LSI) such as long propagation delay, high power consumption and limited I/O bandwidth. Unfortunately, the stacking nature of 3DICs exacerbates...