Study of pool boiling enhancement structures and development of two phase cooling solution for electronics package
Advances in microelectronics design and manufacturing made possibe higher transistor density in a single device. IC chips are now being stacked vertically for better electrical performance and compact system design, which leads to high heat flux in the order of 50W/cm2. Air cooling has poor cooli...
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| Format: | Theses and Dissertations |
| Published: |
2008
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| Online Access: | https://hdl.handle.net/10356/6248 |
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| Institution: | Nanyang Technological University |
| Summary: | Advances in microelectronics design and manufacturing made possibe higher transistor density in a single device. IC chips are now being stacked vertically for better electrical performance and compact system design, which leads to high heat flux in the order of 50W/cm2. Air cooling has poor cooling efficiency for high power application, therefore liquid cooling /boiling heat transfer is preferred due its high heat removal capabilities. Pool boiling heat transfer is investigated for electonic cooling in this research with the target to achive 50W/cm2. |
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