Study of pool boiling enhancement structures and development of two phase cooling solution for electronics package

Study of pool boiling enhancement structures and development of two phase cooling solution for electronics package

Advances in microelectronics design and manufacturing made possibe higher transistor density in a single device. IC chips are now being stacked vertically for better electrical performance and compact system design, which leads to high heat flux in the order of 50W/cm2. Air cooling has poor cooli...

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Main Author: Oratti Kalandar Navas Khan
Other Authors: D. Pinjala
Format: Theses and Dissertations
Published: 2008
Subjects:
DRNTU::Engineering::Mechanical engineering
Online Access:https://hdl.handle.net/10356/6248
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Institution: Nanyang Technological University
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spelling sg-ntu-dr.10356-62482023-03-11T17:24:18Z Study of pool boiling enhancement structures and development of two phase cooling solution for electronics package Oratti Kalandar Navas Khan D. Pinjala Toh Kok Chuan School of Mechanical and Aerospace Engineering DRNTU::Engineering::Mechanical engineering Advances in microelectronics design and manufacturing made possibe higher transistor density in a single device. IC chips are now being stacked vertically for better electrical performance and compact system design, which leads to high heat flux in the order of 50W/cm2. Air cooling has poor cooling efficiency for high power application, therefore liquid cooling /boiling heat transfer is preferred due its high heat removal capabilities. Pool boiling heat transfer is investigated for electonic cooling in this research with the target to achive 50W/cm2. MASTER OF ENGINEERING (MPE) 2008-09-17T11:10:15Z 2008-09-17T11:10:15Z 2006 2006 Thesis Oratti Kalandar Navas Khan. (2006). Study of pool boiling enhancement structures and development of two phase cooling solution for electronics package. Master’s thesis, Nanyang Technological University, Singapore. https://hdl.handle.net/10356/6248 10.32657/10356/6248 Nanyang Technological University application/pdf
institution Nanyang Technological University
building NTU Library
continent Asia
country Singapore
Singapore
content_provider NTU Library
collection DR-NTU
topic DRNTU::Engineering::Mechanical engineering
spellingShingle DRNTU::Engineering::Mechanical engineering
Oratti Kalandar Navas Khan
Study of pool boiling enhancement structures and development of two phase cooling solution for electronics package
description Advances in microelectronics design and manufacturing made possibe higher transistor density in a single device. IC chips are now being stacked vertically for better electrical performance and compact system design, which leads to high heat flux in the order of 50W/cm2. Air cooling has poor cooling efficiency for high power application, therefore liquid cooling /boiling heat transfer is preferred due its high heat removal capabilities. Pool boiling heat transfer is investigated for electonic cooling in this research with the target to achive 50W/cm2.
author2 D. Pinjala
author_facet D. Pinjala
Oratti Kalandar Navas Khan
format Theses and Dissertations
author Oratti Kalandar Navas Khan
author_sort Oratti Kalandar Navas Khan
title Study of pool boiling enhancement structures and development of two phase cooling solution for electronics package
title_short Study of pool boiling enhancement structures and development of two phase cooling solution for electronics package
title_full Study of pool boiling enhancement structures and development of two phase cooling solution for electronics package
title_fullStr Study of pool boiling enhancement structures and development of two phase cooling solution for electronics package
title_full_unstemmed Study of pool boiling enhancement structures and development of two phase cooling solution for electronics package
title_sort study of pool boiling enhancement structures and development of two phase cooling solution for electronics package
publishDate 2008
url https://hdl.handle.net/10356/6248
_version_ 1761781858990817280

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